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NOTES: 1.MATERIAL SPECIFICATION 1-1.HOUSING: PA66+30% G.F BLACK UL94 V-0. 1-2.CONTACT: C2680-1/2H T=0.25mm. 1-3.LATCH: SUS304 T=0.30mm. 2.PLATING SPECIFICATION 2-1.CONTACT: NI30u'' MIN. UNDER PLATED,GOLD FLASH PLATED ON THE FUNCTIONAL AREA OF CONTACT, TIN 80U" MIN. ON SOLDER AREA. 2-2.LATCH: MATTE TIN. 60U" MIN. 3.MECHANICAL PERFORMANCE 3-1.INSERTION FORCE: 1.15N PER CONTACT PAIR MAX. 3-2.WITHDRAWAL FORCE: 0.15N PER CONTACT PAIR MIN. 3-3.DURABILITY: 50 CYCLES. 4.ELECTRICAL PERFORMANCE 4-1.CURRENT RATING: 1.1A PER PIN MIN. 4-2.LLCR: CONTACT: 30 mΩ MAX. 4-3.INSULATION RESISTANCE: 1000 MΩ MIN. 4-4.DIELECTRIC WITHSTAND VOLTAGE: 500V DC/60S. 5.WAVE SOLDING: THE PEAK TEMPERATURE ON BOARD SHALL BE MAINTAINED FOR 10 SECONDS AT 260±5°C. 6.OPERATING TEMPERATURE RANGE: -45°C~105°C. 7.RoHS COMPLIANT OR HALOGEN FREE COMPLIANT. |
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